Applied Materials launched its new Applied Centura Tetra X Advanced Reticle Etch system – the only system capable of etching the photomasks needed for customers’ most challenging device layers at 22nm and beyond. Expanding the capabilities of Applied’s industry-standard Tetra III platform, the Tetra X breaks the 2nm critical dimension uniformity (CDU) barrier across all feature sizes – delivering the critical mask accuracy that can enable mask makers to exceed their customers’ strictest pattern-...